XCZU19EG-2FFVC1760I
IC SOC CORTEX-A53 1760FCBGAManufacturer: AMD
Categories: System On Chip (SoC)
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The AMD Zynq® UltraScale+™ MPSoC EG XCZU19EG-2FFVC1760I is a System On Chip (SOC) featuring a heterogeneous processing system. It integrates a Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ alongside Dual ARM® Cortex™-R5 with CoreSight™ processors, further enhanced by an ARM Mali™-400 MP2 graphics processing unit. This device boasts over 1.1 million logic cells, operating at frequencies up to 1.3GHz, and offers a 256KB of on-chip RAM. Connectivity options include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. Peripherals such as DMA and WDT are also included. This component is designed for demanding applications in the industrial, automotive, and aerospace sectors. The device is supplied in a 1760-FCBGA (42.5x42.5) package and operates within an industrial temperature range of -40°C to 100°C (TJ).
Additional Information
Series: Zynq® UltraScale+™ MPSoC EGRoHS Status: ROHS3 CompliantManufacturer Lead Time: 16 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 1760-BBGA, FCBGA |
| Speed | 533MHz, 600MHz, 1.3GHz |
| RAM Size | 256KB |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DMA, WDT |
| Supplier Device Package | 1760-FCBGA (42.5x42.5) |
| Architecture | MCU, FPGA |
| Flash Size | - |
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