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XCZU19EG-1FFVC1760I

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XCZU19EG-1FFVC1760I

IC SOC CORTEX-A53 1760FCBGA

Manufacturer: AMD

Categories: System On Chip (SoC)

Quality Control: Learn More

The AMD Zynq® UltraScale+™ MPSoC EG XCZU19EG-1FFVC1760I is a heterogeneous System-on-Chip (SoC) integrating a powerful processing system with a versatile programmable logic fabric. This device features a Quad ARM® Cortex®-A53 MPCore™ processor cluster for high-performance application processing, complemented by a Dual ARM® Cortex™-R5 processor cluster for real-time control tasks. Graphics acceleration is provided by the ARM Mali™-400 MP2. The embedded Zynq® UltraScale+™ FPGA fabric offers over 1143K logic cells, configurable to implement custom hardware acceleration and signal processing. Clock speeds range from 500MHz up to 1.2GHz, supporting demanding applications. Connectivity options include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. Peripherals such as DMA and WDT are also integrated. Operating within an extended temperature range of -40°C to 100°C (TJ), this component is suitable for applications in aerospace, defense, automotive, and industrial automation. The device is supplied in a 1760-FCBGA package.

Additional Information

Series: Zynq® UltraScale+™ MPSoC EGRoHS Status: ROHS3 CompliantManufacturer Lead Time: 16 week(s)Product Status: ActivePackaging: TrayDatasheet:
Technical Details:
PackagingTray
Package / Case1760-BBGA, FCBGA
Speed500MHz, 600MHz, 1.2GHz
RAM Size256KB
Operating Temperature-40°C ~ 100°C (TJ)
Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP
Primary AttributesZynq®UltraScale+™ FPGA, 1143K+ Logic Cells
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
PeripheralsDMA, WDT
Supplier Device Package1760-FCBGA (42.5x42.5)
ArchitectureMCU, FPGA
Flash Size-

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