XCZU17EG-3FFVB1517E
IC SOC CORTEX-A53 1517FCBGAManufacturer: AMD
Categories: System On Chip (SoC)
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The AMD Zynq® UltraScale+™ MPSoC EG XCZU17EG-3FFVB1517E is a heterogeneous System On Chip (SoC) device integrating a powerful processing system with programmable logic. It features a Quad ARM® Cortex®-A53 MPCore™ processor for high-level applications, complemented by Dual ARM® Cortex™-R5 processors for real-time control tasks. The embedded ARM Mali™-400 MP2 graphics processing unit accelerates visual processing. This device offers over 926,000+ logic cells within its Zynq®UltraScale+™ FPGA fabric, configurable to operate at speeds up to 1.5GHz. Connectivity options include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. Peripherals such as DMA and WDT are also integrated. This component is suitable for demanding applications in aerospace and defense, automotive, industrial automation, and high-performance computing. The device is supplied in a 1517-FCBGA (40x40) package and operates within a junction temperature range of 0°C to 100°C.
Additional Information
Series: Zynq® UltraScale+™ MPSoC EGRoHS Status: ROHS3 CompliantManufacturer Lead Time: 20 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 1517-BBGA, FCBGA |
| Speed | 600MHz, 667MHz, 1.5GHz |
| RAM Size | 256KB |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DMA, WDT |
| Supplier Device Package | 1517-FCBGA (40x40) |
| Architecture | MCU, FPGA |
| Flash Size | - |
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