XCZU17EG-1FFVD1760E
IC SOC CORTEX-A53 1760FCBGAManufacturer: AMD
Categories: System On Chip (SoC)
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AMD Zynq® UltraScale+™ MPSoC EG XCZU17EG-1FFVD1760E is a heterogeneous System-on-Chip (SoC) combining a powerful processing system with programmable logic. The processing system features a Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, a Dual ARM® Cortex™-R5 with CoreSight™, and an ARM Mali™-400 MP graphics processing unit. This device offers over 926,000 logic cells and operates at clock speeds up to 1.2GHz. Connectivity options include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. Peripherals such as DMA and WDT are integrated. The XCZU17EG-1FFVD1760E is packaged in a 1760-FCBGA with an operating temperature range of 0°C to 100°C (TJ). This component is widely utilized in industrial automation, aerospace and defense, broadcast video, and test and measurement applications.
Additional Information
Series: Zynq® UltraScale+™ MPSoC EGRoHS Status: ROHS3 CompliantManufacturer Lead Time: 16 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 1760-BBGA, FCBGA |
| Speed | 500MHz, 600MHz, 1.2GHz |
| RAM Size | 256KB |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DMA, WDT |
| Supplier Device Package | 1760-FCBGA (42.5x42.5) |
| Architecture | MCU, FPGA |
| Flash Size | - |
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