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XCZU15EG-2FFVC900I

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XCZU15EG-2FFVC900I

IC SOC CORTEX-A53 900FCBGA

Manufacturer: AMD

Categories: System On Chip (SoC)

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The AMD Zynq® UltraScale+™ MPSoC EG series XCZU15EG-2FFVC900I is a heterogeneous System-on-Chip (SoC) device integrating a powerful processing system and programmable logic. It features a Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ for high-performance application processing, alongside Dual ARM® Cortex™-R5 with CoreSight™ for real-time control. Graphics acceleration is provided by the ARM Mali™-400 MP2. This device offers over 747,000 logic cells within its Zynq® UltraScale+™ FPGA fabric, operating at clock speeds up to 1.3GHz. Connectivity options include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. Peripherals such as DMA and WDT are also included. The XCZU15EG-2FFVC900I operates within an industrial temperature range of -40°C to 100°C (TJ) and is housed in a 900-FCBGA (31x31) package. This component is suitable for applications in aerospace and defense, automotive, industrial automation, and high-performance embedded computing.

Additional Information

Series: Zynq® UltraScale+™ MPSoC EGRoHS Status: ROHS3 CompliantManufacturer Lead Time: 16 week(s)Product Status: ActivePackaging: TrayDatasheet:
Technical Details:
PackagingTray
Package / Case900-BBGA, FCBGA
Speed533MHz, 600MHz, 1.3GHz
RAM Size256KB
Operating Temperature-40°C ~ 100°C (TJ)
Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP
Primary AttributesZynq®UltraScale+™ FPGA, 747K+ Logic Cells
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
PeripheralsDMA, WDT
Supplier Device Package900-FCBGA (31x31)
ArchitectureMCU, FPGA
Flash Size-

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