XCZU11EG-2FFVB1517I
IC SOC CORTEX-A53 1517FCBGAManufacturer: AMD
Categories: System On Chip (SoC)
Quality Control: Learn More
The AMD Zynq® UltraScale+™ MPSoC EG XCZU11EG-2FFVB1517I is a heterogeneous System on Chip (SoC) device featuring a Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM® Cortex™-R5 with CoreSight™, and an ARM Mali™-400 MP2 graphics processing unit. This device integrates a Zynq® UltraScale+™ FPGA with over 653,000 logic cells, operating at clock speeds up to 1.3GHz. The 1517-FCBGA (40x40) package houses this powerful processing and programmable logic fabric. Connectivity options include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. Peripherals such as DMA and WDT are also integrated. This component is suitable for demanding applications across industries such as aerospace, defense, industrial automation, and test and measurement. The operating temperature range is -40°C to 100°C (TJ).
Additional Information
Series: Zynq® UltraScale+™ MPSoC EGRoHS Status: ROHS3 CompliantManufacturer Lead Time: 16 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 1517-BBGA, FCBGA |
| Speed | 533MHz, 600MHz, 1.3GHz |
| RAM Size | 256KB |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DMA, WDT |
| Supplier Device Package | 1517-FCBGA (40x40) |
| Architecture | MCU, FPGA |
| Flash Size | - |
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