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XCVM1802-2MLIVFVC1760

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XCVM1802-2MLIVFVC1760

IC VERSAL AICORE FPGA 1760BGA

Manufacturer: AMD

Categories: System On Chip (SoC)

Quality Control: Learn More

The AMD Versal™ Prime XCVM1802-2MLIVFVC1760 is a System on Chip (SoC) device featuring a Versal™ Prime FPGA with 1.9 million logic cells. This component integrates dual ARM® Cortex®-A72 MPCore™ processors and dual ARM® Cortex™-R5F processors, both equipped with CoreSight™ debug capabilities. It operates at clock speeds of 600MHz and 1.4GHz, supporting high-performance applications. The device offers extensive connectivity options including CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. On-chip peripherals include DDR and DMA controllers, along with PCIe support. The XCVM1802-2MLIVFVC1760 is housed in a 1760-FCBGA (40x40) package and operates within a temperature range of -40°C to 100°C (TJ). This device is suitable for demanding applications across industries such as aerospace and defense, automotive, industrial, and wired and wireless communications.

Additional Information

Series: Versal™ PrimeRoHS Status: ROHS3 CompliantManufacturer Lead Time: 18 week(s)Product Status: ActivePackaging: TrayDatasheet:
Technical Details:
PackagingTray
Package / Case1760-BFBGA, FCBGA
Speed600MHz, 1.4GHz
RAM Size256KB
Operating Temperature-40°C ~ 100°C (TJ)
Core ProcessorDual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary AttributesVersal™ Prime FPGA, 1.9M Logic Cells
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
PeripheralsDDR, DMA, PCIe
Supplier Device Package1760-FCBGA (40x40)
ArchitectureMPU, FPGA
Flash Size-

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