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XCVM1802-2LLIVSVA2197

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XCVM1802-2LLIVSVA2197

IC VERSALPRIME ACAP FPGA 2197BGA

Manufacturer: AMD

Categories: System On Chip (SoC)

Quality Control: Learn More

AMD Versal™ Prime ACAP XCVM1802-2LLIVSVA2197 is a System on Chip (SoC) featuring a Versal™ Prime FPGA architecture. This device integrates dual ARM® Cortex®-A72 MPCore™ processors with CoreSight™ and dual ARM® Cortex™-R5F processors with CoreSight™ for robust processing capabilities. It offers 1.9 million logic cells and operates at clock speeds up to 450MHz for the FPGA fabric and 1.08GHz for the processor cores. The component includes extensive connectivity options such as CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, along with peripherals like DDR, DMA, and PCIe. With 256KB of RAM and an operating temperature range of -40°C to 100°C (TJ), this device is packaged in a 2197-FCBGA (45x45) format. It finds application in industries requiring advanced processing and connectivity, including aerospace, defense, automotive, and industrial automation.

Additional Information

Series: Versal™ PrimeRoHS Status: ROHS3 CompliantManufacturer Lead Time: 16 week(s)Product Status: ActivePackaging: TrayDatasheet:
Technical Details:
PackagingTray
Package / Case2197-BFBGA, FCBGA
Speed450MHz, 1.08GHz
RAM Size256KB
Operating Temperature-40°C ~ 100°C (TJ)
Core ProcessorDual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary AttributesVersal™ Prime FPGA, 1.9M Logic Cells
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
PeripheralsDDR, DMA, PCIe
Supplier Device Package2197-FCBGA (45x45)
ArchitectureMPU, FPGA
Flash Size-

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