XCVM1802-2HSIVFVC1760
IC VERSALPRIME ACAP FPGA 1760BGAManufacturer: AMD
Categories: System On Chip (SoC)
Quality Control: Learn More
The AMD Versal™ Prime XCVM1802-2HSIVFVC1760 is an Adaptive Compute Acceleration Platform (ACAP) featuring a powerful dual ARM® Cortex®-A72 MPCore™ and dual ARM® Cortex™-R5F processor system, integrated with CoreSight™. This System on Chip (SoC) offers 1.9 million logic cells and operates at clock speeds up to 800MHz for the FPGA fabric and 1.65GHz for the processing system. The 1760-FCBGA (40x40) package provides extensive connectivity options including CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. Peripherals such as DDR, DMA, and PCIe further enhance its capabilities. This component is suitable for demanding applications in aerospace and defense, automotive, data center, and industrial markets. Its operational temperature range is -40°C to 100°C (TJ).
Additional Information
Series: Versal™ PrimeRoHS Status: ROHS3 CompliantManufacturer Lead Time: 18 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 1760-BFBGA, FCBGA |
| Speed | 800MHz, 1.65GHz |
| RAM Size | 256KB |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Primary Attributes | Versal™ Prime FPGA, 1.9M Logic Cells |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DDR, DMA, PCIe |
| Supplier Device Package | 1760-FCBGA (40x40) |
| Architecture | MPU, FPGA |
| Flash Size | - |
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