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XCVM1802-1LSIVSVD1760

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XCVM1802-1LSIVSVD1760

IC VERSAL AICORE FPGA 1760BGA

Manufacturer: AMD

Categories: System On Chip (SoC)

Quality Control: Learn More

The AMD Versal™ Prime XCVM1802-1LSIVSVD1760 is a System on Chip (SoC) featuring an FPGA architecture. This device integrates dual ARM® Cortex®-A72 MPCore™ processors with CoreSight™ and dual ARM® Cortex™-R5F processors with CoreSight™, offering a powerful heterogeneous processing environment. It provides 1.9 million logic cells operating at up to 400MHz for the FPGA fabric, complemented by a 1GHz core clock speed. Connectivity options include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. On-chip peripherals include DDR and DMA controllers, along with PCIe. The XCVM1802-1LSIVSVD1760 is housed in a 1760-FCBGA (40x40) package and operates within a temperature range of -40°C to 100°C (TJ). This component is suitable for applications in aerospace and defense, automotive, industrial automation, and high-performance computing.

Additional Information

Series: Versal™ PrimeRoHS Status: ROHS3 CompliantManufacturer Lead Time: 16 week(s)Product Status: ActivePackaging: TrayDatasheet:
Technical Details:
PackagingTray
Package / Case1760-BFBGA, FCBGA
Speed400MHz, 1GHz
RAM Size256KB
Operating Temperature-40°C ~ 100°C (TJ)
Core ProcessorDual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary AttributesVersal™ Prime FPGA, 1.9M Logic Cells
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
PeripheralsDDR, DMA, PCIe
Supplier Device Package1760-FCBGA (40x40)
ArchitectureMPU, FPGA
Flash Size-

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