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XCVM1402-2MSIVSVD1760

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XCVM1402-2MSIVSVD1760

IC VERSALPRIME ACAP FPGA 1760BGA

Manufacturer: AMD

Categories: System On Chip (SoC)

Quality Control: Learn More

The AMD Versal™ Prime XCVM1402-2MSIVSVD1760 is an Adaptive Compute Acceleration Platform (ACAP) featuring 1.2 million logic cells. This System on Chip (SoC) integrates dual ARM® Cortex®-A72 MPCore™ processors with CoreSight™ and dual ARM® Cortex™-R5F processors with CoreSight™. Operating at speeds of 600MHz and 1.4GHz, it supports a wide range of connectivity options including CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. Peripherals include DDR, DMA, and PCIe. The device is housed in a 1760-FCBGA (40x40) package and operates within an industrial temperature range of -40°C to 100°C (TJ). This component is suitable for applications in aerospace and defense, automotive, and industrial automation.

Additional Information

Series: Versal™ PrimeRoHS Status: ROHS3 CompliantManufacturer Lead Time: 26 week(s)Product Status: ActivePackaging: TrayDatasheet:
Technical Details:
PackagingTray
Package / Case1760-BFBGA, FCBGA
Speed600MHz, 1.4GHz
RAM Size-
Operating Temperature-40°C ~ 100°C (TJ)
Core ProcessorDual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary AttributesVersal™ Prime FPGA, 1.2M Logic Cells
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
PeripheralsDDR, DMA, PCIe
Supplier Device Package1760-FCBGA (40x40)
ArchitectureMPU, FPGA
Flash Size-

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