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XCVM1402-2MSEVSVD1760

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XCVM1402-2MSEVSVD1760

IC VERSALPRIME ACAP FPGA 1760BGA

Manufacturer: AMD

Categories: System On Chip (SoC)

Quality Control: Learn More

The AMD Versal™ Prime XCVM1402-2MSEVSVD1760 is an ACAP device featuring a sophisticated heterogeneous architecture. It integrates dual ARM® Cortex®-A72 MPCore™ processors with CoreSight™ and dual ARM® Cortex™-R5F processors with CoreSight™ for robust control and real-time processing. This Versal™ Prime FPGA offers 1.2 million logic cells and operates at speeds up to 600MHz for the application processors and 1.4GHz for the hardened IP. Connectivity options include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. Peripherals such as DDR, DMA, and PCIe are also supported. The device is housed in a 1760-FCBGA (40x40) package and operates within a junction temperature range of 0°C to 100°C. This component is widely utilized in aerospace, defense, automotive, and industrial applications.

Additional Information

Series: Versal™ PrimeRoHS Status: ROHS3 CompliantManufacturer Lead Time: 26 week(s)Product Status: ActivePackaging: TrayDatasheet:
Technical Details:
PackagingTray
Package / Case1760-BFBGA, FCBGA
Speed600MHz, 1.4GHz
RAM Size-
Operating Temperature0°C ~ 100°C (TJ)
Core ProcessorDual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary AttributesVersal™ Prime FPGA, 1.2M Logic Cells
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
PeripheralsDDR, DMA, PCIe
Supplier Device Package1760-FCBGA (40x40)
ArchitectureMPU, FPGA
Flash Size-

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