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XCVM1402-2MLENSVF1369

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XCVM1402-2MLENSVF1369

IC VERSALPRIME ACAP FPGA 1369BGA

Manufacturer: AMD

Categories: System On Chip (SoC)

Quality Control: Learn More

The AMD Versal™ Prime XCVM1402-2MLENSVF1369 is a System on Chip (SoC) featuring a Versal™ Prime FPGA architecture. This device integrates dual ARM® Cortex®-A72 MPCore™ processors with CoreSight™ and dual ARM® Cortex™-R5F processors with CoreSight™, offering a powerful heterogeneous processing platform. With 1.2 million logic cells and clock speeds up to 1.4GHz, it is designed for high-performance applications. Connectivity options include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. Peripherals such as DDR, DMA, and PCIe are also supported. This component is suitable for use in aerospace and defense, automotive, data center, and industrial applications requiring advanced processing and connectivity. Supplied in a 1369-BGA (35x35) package, it operates within a temperature range of 0°C to 100°C (TJ).

Additional Information

Series: Versal™ PrimeRoHS Status: ROHS3 CompliantManufacturer Lead Time: 16 week(s)Product Status: ActivePackaging: TrayDatasheet:
Technical Details:
PackagingTray
Package / Case1369-BFBGA
Speed600MHz, 1.4GHz
RAM Size-
Operating Temperature0°C ~ 100°C (TJ)
Core ProcessorDual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary AttributesVersal™ Prime FPGA, 1.2M Logic Cells
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
PeripheralsDDR, DMA, PCIe
Supplier Device Package1369-BGA (35x35)
ArchitectureMPU, FPGA
Flash Size-

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