XCVM1402-1MSEVSVD1760
IC VERSALPRIME ACAP FPGA 1760BGAManufacturer: AMD
Categories: System On Chip (SoC)
Quality Control: Learn More
AMD Versal™ Prime ACAP, Part Number XCVM1402-1MSEVSVD1760, is a high-performance adaptable compute acceleration platform. This device integrates dual ARM® Cortex®-A72 MPCore™ processors and dual ARM® Cortex™-R5F processors, both featuring CoreSight™ technology, within a System on Chip (SoC) architecture. It offers 1.2 million logic cells and operates at speeds of 600MHz and 1.3GHz. The XCVM1402-1MSEVSVD1760 is housed in a 1760-FCBGA (40x40) package. Connectivity options include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. Peripherals such as DDR, DMA, and PCIe are supported. This component is suitable for applications in automotive, industrial, and aerospace and defense markets. The operating temperature range is 0°C to 100°C (TJ).
Additional Information
Series: Versal™ PrimeRoHS Status: ROHS3 CompliantManufacturer Lead Time: 26 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 1760-BFBGA, FCBGA |
| Speed | 600MHz, 1.3GHz |
| RAM Size | - |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Primary Attributes | Versal™ Prime FPGA, 1.2M Logic Cells |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DDR, DMA, PCIe |
| Supplier Device Package | 1760-FCBGA (40x40) |
| Architecture | MPU, FPGA |
| Flash Size | - |
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