XCVM1402-1LSIVSVD1760
IC VERSALPRIME ACAP FPGA 1760BGAManufacturer: AMD
Categories: System On Chip (SoC)
Quality Control: Learn More
The AMD Versal™ Prime XCVM1402-1LSIVSVD1760 is an advanced ACAP (Adaptive Compute Acceleration Platform) featuring a 1.2M logic cell FPGA fabric. This System On Chip (SoC) integrates dual ARM® Cortex®-A72 MPCore™ processors and dual ARM® Cortex™-R5F processors, both equipped with CoreSight™. The device operates at speeds of 400MHz and 1GHz, providing substantial processing and acceleration capabilities. Connectivity options include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. Peripherals such as DDR, DMA, and PCIe are also supported. The XCVM1402-1LSIVSVD1760 is housed in a 1760-FCBGA (40x40) package and operates within a temperature range of -40°C to 100°C (TJ). This component is suitable for demanding applications in aerospace and defense, automotive, industrial, and networking sectors.
Additional Information
Series: Versal™ PrimeRoHS Status: ROHS3 CompliantManufacturer Lead Time: 26 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 1760-BFBGA, FCBGA |
| Speed | 400MHz, 1GHz |
| RAM Size | - |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Primary Attributes | Versal™ Prime FPGA, 1.2M Logic Cells |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DDR, DMA, PCIe |
| Supplier Device Package | 1760-FCBGA (40x40) |
| Architecture | MPU, FPGA |
| Flash Size | - |
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