XCVM1402-1LLIVSVD1760
IC VERSALPRIME ACAP FPGA 1760BGAManufacturer: AMD
Categories: System On Chip (SoC)
Quality Control: Learn More
AMD Versal™ Prime ACAP, part number XCVM1402-1LLIVSVD1760, is a System on Chip (SoC) featuring a powerful architecture combining MPU and FPGA capabilities. It integrates dual ARM® Cortex®-A72 MPCore™ processors and dual ARM® Cortex™-R5F processors, both equipped with CoreSight™ for advanced debugging. This device offers 1.2 million logic cells and operates at speeds up to 400MHz and 1GHz. The 1760-FCBGA (40x40) package provides extensive I/O connectivity including CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, along with DDR, DMA, and PCIe peripherals. This versatile component is suitable for demanding applications in aerospace, defense, automotive, and industrial automation sectors.
Additional Information
Series: Versal™ PrimeRoHS Status: ROHS3 CompliantManufacturer Lead Time: 26 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 1760-BFBGA, FCBGA |
| Speed | 400MHz, 1GHz |
| RAM Size | - |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Primary Attributes | Versal™ Prime FPGA, 1.2M Logic Cells |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DDR, DMA, PCIe |
| Supplier Device Package | 1760-FCBGA (40x40) |
| Architecture | MPU, FPGA |
| Flash Size | - |
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