XCVM1302-2MSIVSVD1760
IC VERSALPRIME ACAP FPGA 1760BGAManufacturer: AMD
Categories: System On Chip (SoC)
Quality Control: Learn More
AMD Versal™ Prime XCVM1302-2MSIVSVD1760 is a System On Chip (SoC) featuring an FPGA with 70k logic cells. This device integrates dual ARM® Cortex®-A72 MPCore™ processors with CoreSight™ and dual ARM® Cortex™-R5F processors with CoreSight™. Operating at 600MHz for the Cortex-A72 cores and 1.4GHz for the Cortex-R5F cores, it offers robust processing capabilities. The XCVM1302-2MSIVSVD1760 is housed in a 1760-FCBGA (40x40) package and supports various connectivity interfaces including CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. Peripherals include DDR, DMA, and PCIe. This component is designed for applications in aerospace, defense, automotive, and industrial markets. It operates within a temperature range of -40°C to 100°C (TJ).
Additional Information
Series: Versal™ PrimeRoHS Status: ROHS3 CompliantManufacturer Lead Time: 26 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 1760-BFBGA, FCBGA |
| Speed | 600MHz, 1.4GHz |
| RAM Size | - |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Primary Attributes | Versal™ Prime FPGA, 70k Logic Cells |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DDR, DMA, PCIe |
| Supplier Device Package | 1760-FCBGA (40x40) |
| Architecture | MPU, FPGA |
| Flash Size | - |
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