XCVM1302-2MSINSVF1369
IC VERSALPRIME ACAP FPGA 1369BGAManufacturer: AMD
Categories: System On Chip (SoC)
Quality Control: Learn More
The AMD Versal™ Prime XCVM1302-2MSINSVF1369 is a System on Chip (SoC) featuring a Versal™ Prime FPGA architecture. This component integrates dual ARM® Cortex®-A72 MPCore™ processors with CoreSight™, alongside dual ARM® Cortex™-R5F processors also with CoreSight™. It offers 70k logic cells and operates at clock speeds of 600MHz and 1.4GHz. Connectivity options include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. Peripherals such as DDR, DMA, and PCIe are supported. This device is supplied in a 1369-BGA (35x35) package and operates within a temperature range of -40°C to 100°C (TJ). The Versal™ Prime series is utilized in applications across the automotive, aerospace, defense, and wired communication industries.
Additional Information
Series: Versal™ PrimeRoHS Status: ROHS3 CompliantManufacturer Lead Time: 16 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 1369-BFBGA |
| Speed | 600MHz, 1.4GHz |
| RAM Size | - |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Primary Attributes | Versal™ Prime FPGA, 70k Logic Cells |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DDR, DMA, PCIe |
| Supplier Device Package | 1369-BGA (35x35) |
| Architecture | MPU, FPGA |
| Flash Size | - |
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