XCVM1302-2MLIVSVD1760
IC VERSALPRIME ACAP FPGA 1760BGAManufacturer: AMD
Categories: System On Chip (SoC)
Quality Control: Learn More
The AMD Versal™ Prime XCVM1302-2MLIVSVD1760 is an ACAP (Adaptive Compute Acceleration Platform) featuring dual ARM® Cortex®-A72 MPCore™ processors and dual ARM® Cortex™-R5F processors, all integrated with CoreSight™ for advanced debugging. This Versal™ Prime FPGA offers 70k logic cells and operates at speeds up to 600MHz for the Cortex-A72 cores and 1.4GHz for the Cortex-R5F cores. It is housed in a 1760-FCBGA (40x40) package, suitable for demanding applications. Connectivity options include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. On-chip peripherals include DDR and DMA controllers, along with PCIe support. This component is designed for use in industries such as aerospace and defense, automotive, industrial automation, and networking infrastructure. The operating temperature range is -40°C to 100°C (TJ).
Additional Information
Series: Versal™ PrimeRoHS Status: ROHS3 CompliantManufacturer Lead Time: 26 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 1760-BFBGA, FCBGA |
| Speed | 600MHz, 1.4GHz |
| RAM Size | - |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Primary Attributes | Versal™ Prime FPGA, 70k Logic Cells |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DDR, DMA, PCIe |
| Supplier Device Package | 1760-FCBGA (40x40) |
| Architecture | MPU, FPGA |
| Flash Size | - |
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