XCVM1302-2MLINSVF1369
IC VERSALPRIME ACAP FPGA 1369BGAManufacturer: AMD
Categories: System On Chip (SoC)
Quality Control: Learn More
The AMD Versal™ Prime XCVM1302-2MLINSVF1369 is a System on Chip (SoC) featuring a Versal™ Prime FPGA architecture. This device integrates dual ARM® Cortex®-A72 MPCore™ processors with CoreSight™ and dual ARM® Cortex™-R5F processors with CoreSight™. It offers 70k logic cells and operates at speeds up to 600MHz for the FPGA fabric and 1.4GHz for the processor cores. Connectivity options include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. Peripherals such as DDR, DMA, and PCIe are also integrated. This component is suitable for demanding applications in the aerospace, defense, automotive, and industrial markets. It is supplied in a 1369-BGA (35x35) package and operates within a temperature range of -40°C to 100°C (TJ).
Additional Information
Series: Versal™ PrimeRoHS Status: ROHS3 CompliantManufacturer Lead Time: 16 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 1369-BFBGA |
| Speed | 600MHz, 1.4GHz |
| RAM Size | - |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Primary Attributes | Versal™ Prime FPGA, 70k Logic Cells |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DDR, DMA, PCIe |
| Supplier Device Package | 1369-BGA (35x35) |
| Architecture | MPU, FPGA |
| Flash Size | - |
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