XCVM1302-2MLINBVB1024
IC VERSALPRIME ACAP FPGA 1024BGAManufacturer: AMD
Categories: System On Chip (SoC)
Quality Control: Learn More
The AMD Versal™ Prime series XCVM1302-2MLINBVB1024 is an Adaptive Compute Acceleration Platform (ACAP) featuring a powerful heterogeneous architecture. This device integrates dual ARM® Cortex®-A72 MPCore™ processors with CoreSight™ and dual ARM® Cortex™-R5F processors with CoreSight™ for robust embedded processing capabilities. It offers 70,000 logic cells and operates at speeds up to 600MHz for the Cortex-A72 cores and 1.4GHz for the Cortex-R5F cores. The XCVM1302-2MLINBVB1024 is supplied in a 1024-BGA (31x31) package and supports a wide range of connectivity options including CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. Peripherals include DDR controllers, DMA engines, and PCIe interfaces. This ACAP is suitable for demanding applications in automotive, industrial, and networking markets requiring high levels of compute acceleration and customization. Operating temperature range is -40°C to 100°C (TJ).
Additional Information
Series: Versal™ PrimeRoHS Status: ROHS3 CompliantManufacturer Lead Time: 16 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 1024-BFBGA |
| Speed | 600MHz, 1.4GHz |
| RAM Size | - |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Primary Attributes | Versal™ Prime FPGA, 70k Logic Cells |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DDR, DMA, PCIe |
| Supplier Device Package | 1024-BGA (31x31) |
| Architecture | MPU, FPGA |
| Flash Size | - |
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