XCVM1302-2MLENSVF1369
IC VERSALPRIME ACAP FPGA 1369BGAManufacturer: AMD
Categories: System On Chip (SoC)
Quality Control: Learn More
AMD Versal™ Prime XCVM1302-2MLENSVF1369 is an Adaptive Compute Acceleration Platform (ACAP) featuring a dual ARM® Cortex®-A72 MPCore™ and dual ARM® Cortex™-R5F processor system, both equipped with CoreSight™. This SoC integrates 70k logic cells and operates at speeds up to 600MHz for the Cortex-A72 cores and 1.4GHz for the Cortex-R5F cores. The device supports a wide range of connectivity options including CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. On-chip peripherals include DDR, DMA, and PCIe. This component is commonly utilized in aerospace, defense, industrial, and automotive applications requiring high-performance processing and flexible acceleration. The XCVM1302-2MLENSVF1369 comes in a 1369-BGA (35x35) package and is supplied in trays.
Additional Information
Series: Versal™ PrimeRoHS Status: ROHS3 CompliantManufacturer Lead Time: 16 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 1369-BFBGA |
| Speed | 600MHz, 1.4GHz |
| RAM Size | - |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Primary Attributes | Versal™ Prime FPGA, 70k Logic Cells |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DDR, DMA, PCIe |
| Supplier Device Package | 1369-BGA (35x35) |
| Architecture | MPU, FPGA |
| Flash Size | - |
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