XCVM1302-2HSINBVB1024
IC VERSALPRIME ACAP FPGA 1024BGAManufacturer: AMD
Categories: System On Chip (SoC)
Quality Control: Learn More
AMD Versal™ Prime series XCVM1302-2HSINBVB1024 is a System on Chip (SoC) featuring a powerful heterogeneous architecture. This device integrates dual ARM® Cortex®-A72 MPCore™ processors with CoreSight™ and dual ARM® Cortex™-R5F processors with CoreSight™ for comprehensive processing capabilities. The core FPGA fabric within the Versal™ Prime series offers 70k logic cells, operating at clock speeds up to 600MHz for the Cortex-A72 cores and 1.4GHz for the Cortex-R5F cores. Connectivity options are extensive, including CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. On-chip peripherals include DDR, DMA, and PCIe. This component is supplied in a 1024-BGA (31x31) package, suitable for demanding applications in industries such as aerospace and defense, automotive, and industrial automation. The operating junction temperature range is -40°C to 100°C.
Additional Information
Series: Versal™ PrimeRoHS Status: ROHS3 CompliantManufacturer Lead Time: 16 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 1024-BFBGA |
| Speed | 600MHz, 1.4GHz |
| RAM Size | 256KB |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Primary Attributes | Versal™ Prime FPGA, 70k Logic Cells |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DDR, DMA, PCIe |
| Supplier Device Package | 1024-BGA (31x31) |
| Architecture | MPU, FPGA |
| Flash Size | - |
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