XCVM1302-1MSIVSVD1760
IC VERSALPRIME ACAP FPGA 1760BGAManufacturer: AMD
Categories: System On Chip (SoC)
Quality Control: Learn More
AMD Versal™ Prime ACAP XCVM1302-1MSIVSVD1760 is a System on Chip (SoC) featuring a dual ARM® Cortex®-A72 MPCore™ with CoreSight™ and dual ARM® Cortex™-R5F with CoreSight™ processor system. This device integrates a Versal™ Prime FPGA with 70k logic cells and operates at speeds of 600MHz and 1.3GHz. Its architecture combines MPU and FPGA capabilities, offering extensive connectivity options including CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. Peripherals include DDR, DMA, and PCIe support. The component is supplied in a 1760-FCBGA (40x40) package and operates within an industrial temperature range of -40°C to 100°C (TJ). This device is suitable for applications in aerospace and defense, automotive, industrial automation, and wired and wireless communications.
Additional Information
Series: Versal™ PrimeRoHS Status: ROHS3 CompliantManufacturer Lead Time: 26 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 1760-BFBGA, FCBGA |
| Speed | 600MHz, 1.3GHz |
| RAM Size | - |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Primary Attributes | Versal™ Prime FPGA, 70k Logic Cells |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DDR, DMA, PCIe |
| Supplier Device Package | 1760-FCBGA (40x40) |
| Architecture | MPU, FPGA |
| Flash Size | - |
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