XCVM1302-1MSENSVF1369
IC VERSALPRIME ACAP FPGA 1369BGAManufacturer: AMD
Categories: System On Chip (SoC)
Quality Control: Learn More
The AMD Versal™ Prime XCVM1302-1MSENSVF1369 is an ACAP (Adaptive Compute Acceleration Platform) featuring a Versal™ Prime FPGA with 70k logic cells. This System on Chip (SoC) integrates dual ARM® Cortex®-A72 MPCore™ processors with CoreSight™ and dual ARM® Cortex™-R5F processors with CoreSight™. The device operates at speeds up to 600MHz for the FPGA fabric and 1.3GHz for the processor cores. It supports a wide range of connectivity options including CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. Peripherals include DDR, DMA, and PCIe interfaces. The XCVM1302-1MSENSVF1369 is housed in a 1369-BGA (35x35) package and operates within an ambient temperature range of 0°C to 100°C (TJ). This component is suitable for applications in automotive, aerospace, industrial, and networking sectors.
Additional Information
Series: Versal™ PrimeRoHS Status: ROHS3 CompliantManufacturer Lead Time: 16 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 1369-BFBGA |
| Speed | 600MHz, 1.3GHz |
| RAM Size | - |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Primary Attributes | Versal™ Prime FPGA, 70k Logic Cells |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DDR, DMA, PCIe |
| Supplier Device Package | 1369-BGA (35x35) |
| Architecture | MPU, FPGA |
| Flash Size | - |
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