XCVM1302-1MSENBVB1024
IC VERSALPRIME ACAP FPGA 1024BGAManufacturer: AMD
Categories: System On Chip (SoC)
Quality Control: Learn More
AMD Versal™ Prime series XCVM1302-1MSENBVB1024 is a System On Chip (SoC) featuring a heterogeneous architecture combining MPU and FPGA capabilities. This device integrates dual ARM® Cortex®-A72 MPCore™ processors with CoreSight™ and dual ARM® Cortex™-R5F processors with CoreSight™ for advanced control and real-time processing. The FPGA fabric offers 70k logic cells, operating at speeds up to 600MHz for the Cortex-A72 cores and 1.3GHz for the Cortex-R5F cores. Connectivity options include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, alongside peripherals such as DDR, DMA, and PCIe. The XCVM1302-1MSENBVB1024 is supplied in a 1024-BGA (31x31) package, suitable for demanding applications in aerospace and defense, automotive, and industrial markets. Operating temperature range is 0°C to 100°C (TJ).
Additional Information
Series: Versal™ PrimeRoHS Status: ROHS3 CompliantManufacturer Lead Time: 16 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 1024-BFBGA |
| Speed | 600MHz, 1.3GHz |
| RAM Size | - |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Primary Attributes | Versal™ Prime FPGA, 70k Logic Cells |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DDR, DMA, PCIe |
| Supplier Device Package | 1024-BGA (31x31) |
| Architecture | MPU, FPGA |
| Flash Size | - |
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