XCVM1302-1LSINSVF1369
IC VERSALPRIME ACAP FPGA 1369BGAManufacturer: AMD
Categories: System On Chip (SoC)
Quality Control: Learn More
AMD Versal™ Prime XCVM1302-1LSINSVF1369 is a System on Chip (SoC) featuring a configurable FPGA fabric with 70k logic cells. This device integrates dual ARM Cortex-A72 MPCore processors and dual ARM Cortex-R5F processors, both equipped with CoreSight technology. Operating at speeds up to 400MHz for the Cortex-A72 cores and 1GHz for the Cortex-R5F cores, it offers extensive connectivity options including CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. Integrated peripherals include DDR and DMA controllers, along with PCIe support. The XCVM1302-1LSINSVF1369 is housed in a 1369-BGA (35x35) package and operates within a temperature range of -40°C to 100°C (TJ). This component is suitable for applications in aerospace and defense, automotive, industrial automation, and wired and wireless communications.
Additional Information
Series: Versal™ PrimeRoHS Status: ROHS3 CompliantManufacturer Lead Time: 16 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 1369-BFBGA |
| Speed | 400MHz, 1GHz |
| RAM Size | - |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Primary Attributes | Versal™ Prime FPGA, 70k Logic Cells |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DDR, DMA, PCIe |
| Supplier Device Package | 1369-BGA (35x35) |
| Architecture | MPU, FPGA |
| Flash Size | - |
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