XCVM1302-1LSENSVF1369
IC VERSALPRIME ACAP FPGA 1369BGAManufacturer: AMD
Categories: System On Chip (SoC)
Quality Control: Learn More
AMD Versal™ Prime XCVM1302-1LSENSVF1369 is an Adaptive Compute Acceleration Platform (ACAP) featuring a Versal™ Prime FPGA architecture. This SoC integrates dual ARM® Cortex®-A72 MPCore™ processors and dual ARM® Cortex™-R5F processors, both equipped with CoreSight™. It offers 70,000 logic cells and operates at speeds up to 600MHz for the FPGA fabric and 1.3GHz for the processor cores. The device is housed in a 1369-BGA (35x35) package. Connectivity options include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. Peripherals such as DDR, DMA, and PCIe are also supported, along with 256KB of RAM. This component is suitable for demanding applications in industries like aerospace and defense, automotive, data center, and industrial automation.
Additional Information
Series: Versal™ PrimeRoHS Status: ROHS3 CompliantManufacturer Lead Time: 16 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 1369-BFBGA |
| Speed | 600MHz, 1.3GHz |
| RAM Size | 256KB |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Primary Attributes | Versal™ Prime FPGA, 70k Logic Cells |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DDR, DMA, PCIe |
| Supplier Device Package | 1369-BGA (35x35) |
| Architecture | MPU, FPGA |
| Flash Size | - |
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