XCVE1752-1LSINSVG1369
IC VERSAL AI-EDGE FPGA 1369BGAManufacturer: AMD
Categories: System On Chip (SoC)
Quality Control: Learn More
The AMD Versal™ AI Core series XCVE1752-1LSINSVG1369 is a System on Chip (SoC) featuring a heterogeneous architecture combining ARM Cortex-A72 and Cortex-R5F processors with AI Engine capabilities. This device offers 1 million logic cells and operates at speeds up to 400MHz for the main logic and 1GHz for the processor cores. It is housed in a 1369-FCBGA package with a 35x35mm footprint. Connectivity options include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, along with peripherals like DDR, DMA, and PCIe. This component is suitable for applications in automotive, industrial, aerospace, and test and measurement sectors requiring advanced signal processing and intelligent acceleration.
Additional Information
Series: Versal™ AI CoreRoHS Status: ROHS3 CompliantManufacturer Lead Time: 16 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 1369-BFBGA, FCBGA |
| Speed | 400MHz, 1GHz |
| RAM Size | - |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Primary Attributes | Versal™ AI Core FPGA, 1M Logic Cells |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DDR, DMA, PCIe |
| Supplier Device Package | 1369-FCBGA (35x35) |
| Architecture | MPU, FPGA |
| Flash Size | - |
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