XCVE1752-1LSEVSVA2197
IC VERSAL AI-EDGE FPGA 2197BGAManufacturer: AMD
Categories: System On Chip (SoC)
Quality Control: Learn More
The AMD Versal™ AI Core series XCVE1752-1LSEVSVA2197 is a System on Chip (SoC) featuring a Versal™ AI Core FPGA with approximately 1 million logic cells. This device integrates dual ARM® Cortex®-A72 MPCore™ processors with CoreSight™ and dual ARM® Cortex™-R5F processors with CoreSight™, operating at speeds up to 400MHz and 1GHz respectively. It supports a wide range of connectivity options including CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, along with peripherals like DDR, DMA, and PCIe. The XCVE1752-1LSEVSVA2197 is housed in a 2197-FCBGA (45x45) package and operates within a temperature range of 0°C to 100°C (TJ). This component is suitable for applications in automotive, data center, and industrial sectors.
Additional Information
Series: Versal™ AI CoreRoHS Status: ROHS3 CompliantManufacturer Lead Time: 16 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 2197-BFBGA, FCBGA |
| Speed | 400MHz, 1GHz |
| RAM Size | - |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Primary Attributes | Versal™ AI Core FPGA, 1M Logic Cells |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DDR, DMA, PCIe |
| Supplier Device Package | 2197-FCBGA (45x45) |
| Architecture | MPU, FPGA |
| Flash Size | - |
Request a Quote
Clients Also Buy
XCVC1502-1MSENSVG1369
IC VERSAL AI-CORE FPGA 1369BGA
XCVE1752-1MSENSVG1369
IC VERSAL AI-CORE FPGA 1369BGA
XCVC1702-1MSENSVG1369
IC VERSAL AI-CORE FPGA 1369BGA
