XCVE1752-1LSENSVG1369
IC VERSAL AI-EDGE FPGA 1369BGAManufacturer: AMD
Categories: System On Chip (SoC)
Quality Control: Learn More
The AMD Versal™ AI Core XCVE1752-1LSENSVG1369 is a System on Chip (SoC) featuring an FPGA architecture designed for demanding applications. This device integrates dual ARM® Cortex®-A72 MPCore™ processors and dual ARM® Cortex™-R5F processors, both with CoreSight™ for advanced debugging. It offers 1 million logic cells operating at up to 400MHz, alongside specialized AI engines capable of 1GHz operation. The 1369-FCBGA (35x35) package provides extensive connectivity options including CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. On-chip peripherals include DDR, DMA, and PCIe. This component is suitable for industries such as automotive, aerospace, and industrial automation where high-performance processing and flexible hardware acceleration are critical.
Additional Information
Series: Versal™ AI CoreRoHS Status: ROHS3 CompliantManufacturer Lead Time: 16 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 1369-BFBGA, FCBGA |
| Speed | 400MHz, 1GHz |
| RAM Size | - |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Primary Attributes | Versal™ AI Core FPGA, 1M Logic Cells |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DDR, DMA, PCIe |
| Supplier Device Package | 1369-FCBGA (35x35) |
| Architecture | MPU, FPGA |
| Flash Size | - |
Request a Quote
Clients Also Buy
XCVC1502-1MSENSVG1369
IC VERSAL AI-CORE FPGA 1369BGA
XCVE1752-1MSENSVG1369
IC VERSAL AI-CORE FPGA 1369BGA
XCVC1702-1MSENSVG1369
IC VERSAL AI-CORE FPGA 1369BGA
