XCVC1702-2LLEVSVA2197
IC VERSAL AI-CORE FPGA 2197BGAManufacturer: AMD
Categories: System On Chip (SoC)
Quality Control: Learn More
The AMD Versal™ AI Core series XCVC1702-2LLEVSVA2197 is a System On Chip (SoC) featuring an FPGA fabric. This device integrates dual ARM® Cortex®-A72 MPCore™ processors and dual ARM® Cortex™-R5F processors, both equipped with CoreSight™ technology. The FPGA offers 1M logic cells and operates at speeds up to 450MHz for the fabric and 1.08GHz for the processor cores. Connectivity options include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. Peripherals such as DDR, DMA, and PCIe are also incorporated. The XCVC1702-2LLEVSVA2197 is supplied in a 2197-FCBGA (45x45) package and operates within a junction temperature range of 0°C to 100°C. This component is suitable for applications in automotive, aerospace, industrial, and networking sectors.
Additional Information
Series: Versal™ AI CoreRoHS Status: ROHS3 CompliantManufacturer Lead Time: 16 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 2197-BFBGA, FCBGA |
| Speed | 450MHz, 1.08GHz |
| RAM Size | - |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Primary Attributes | Versal™ AI Core FPGA, 1M Logic Cells |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DDR, DMA, PCIe |
| Supplier Device Package | 2197-FCBGA (45x45) |
| Architecture | MPU, FPGA |
| Flash Size | - |
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