XCVC1702-1LSIVSVA2197
IC VERSAL AI-CORE FPGA 2197BGAManufacturer: AMD
Categories: System On Chip (SoC)
Quality Control: Learn More
AMD Versal™ AI Core Series XCVC1702-1LSIVSVA2197 is a System on Chip (SoC) device featuring a Versal™ AI Core FPGA architecture. This component integrates dual ARM® Cortex®-A72 MPCore™ processors with CoreSight™ and dual ARM® Cortex™-R5F processors with CoreSight™ for robust processing capabilities. It offers 1 million logic cells operating at 400MHz and a 1GHz clock speed. Connectivity options include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. Peripherals such as DDR, DMA, and PCIe are also supported. This device is suitable for applications in aerospace and defense, automotive, data center, and industrial sectors. The package is a 2197-FCBGA (45x45), and it operates within a temperature range of -40°C to 100°C (TJ).
Additional Information
Series: Versal™ AI CoreRoHS Status: ROHS3 CompliantManufacturer Lead Time: 16 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 2197-BFBGA, FCBGA |
| Speed | 400MHz, 1GHz |
| RAM Size | - |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Primary Attributes | Versal™ AI Core FPGA, 1M Logic Cells |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DDR, DMA, PCIe |
| Supplier Device Package | 2197-FCBGA (45x45) |
| Architecture | MPU, FPGA |
| Flash Size | - |
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