XCVC1702-1LSINSVG1369
IC VERSAL AI-CORE FPGA 1369BGAManufacturer: AMD
Categories: System On Chip (SoC)
Quality Control: Learn More
The AMD Versal™ AI Core XCVC1702-1LSINSVG1369 is a System on Chip (SoC) featuring a powerful architecture combining MPU and FPGA capabilities. This device integrates dual ARM® Cortex®-A72 MPCore™ processors with CoreSight™ and dual ARM® Cortex™-R5F processors with CoreSight™ for robust control and real-time processing. It offers 1 million logic cells operating at speeds up to 400MHz, complemented by a 1GHz AI engine. Connectivity options include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, alongside peripherals like DDR, DMA, and PCIe. The XCVC1702-1LSINSVG1369 is housed in a 1369-FCBGA (35x35) package and is designed for operation within a -40°C to 100°C temperature range. This component series is widely utilized in applications requiring advanced acceleration, including automotive, aerospace and defense, and industrial automation.
Additional Information
Series: Versal™ AI CoreRoHS Status: ROHS3 CompliantManufacturer Lead Time: 16 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 1369-BFBGA, FCBGA |
| Speed | 400MHz, 1GHz |
| RAM Size | - |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Primary Attributes | Versal™ AI Core FPGA, 1M Logic Cells |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DDR, DMA, PCIe |
| Supplier Device Package | 1369-FCBGA (35x35) |
| Architecture | MPU, FPGA |
| Flash Size | - |
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