XCVC1702-1LSEVSVA2197
IC VERSAL AI-CORE FPGA 2197BGAManufacturer: AMD
Categories: System On Chip (SoC)
Quality Control: Learn More
AMD Versal™ AI Core Series XCVC1702-1LSEVSVA2197 is a System on Chip (SoC) featuring a dual ARM® Cortex®-A72 MPCore™ with CoreSight™ and dual ARM® Cortex™-R5F with CoreSight™ core processors. This Versal™ AI Core FPGA offers 1 million logic cells operating at speeds up to 400MHz and 1GHz. It supports various interfaces including CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, along with peripherals like DDR, DMA, and PCIe. The device is packaged in a 2197-FCBGA (45x45) and operates within an industrial temperature range of 0°C to 100°C (TJ). This component is suitable for demanding applications in aerospace and defense, automotive, and industrial automation sectors.
Additional Information
Series: Versal™ AI CoreRoHS Status: ROHS3 CompliantManufacturer Lead Time: 16 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 2197-BFBGA, FCBGA |
| Speed | 400MHz, 1GHz |
| RAM Size | - |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Primary Attributes | Versal™ AI Core FPGA, 1M Logic Cells |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DDR, DMA, PCIe |
| Supplier Device Package | 2197-FCBGA (45x45) |
| Architecture | MPU, FPGA |
| Flash Size | - |
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