XCVC1502-1LSINSVG1369
IC VERSAL AI-CORE FPGA 1369BGAManufacturer: AMD
Categories: System On Chip (SoC)
Quality Control: Learn More
AMD Versal™ AI Core Series XCVC1502-1LSINSVG1369 is a System On Chip (SoC) featuring a Versal™ Prime FPGA with 80k logic cells. This device integrates dual ARM® Cortex®-A72 MPCore™ processors and dual ARM® Cortex™-R5F processors, both equipped with CoreSight™ technology. Operating at 400MHz and 1GHz speeds, it offers extensive connectivity options including CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. Peripherals include DDR, DMA, and PCIe. The XCVC1502-1LSINSVG1369 is housed in a 1369-FCBGA (35x35) package and operates within a temperature range of -40°C to 100°C (TJ). This component is widely utilized in industries such as automotive, aerospace and defense, data center, and industrial applications.
Additional Information
Series: Versal™ AI CoreRoHS Status: ROHS3 CompliantManufacturer Lead Time: 16 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 1369-BFBGA, FCBGA |
| Speed | 400MHz, 1GHz |
| RAM Size | - |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Primary Attributes | Versal™ Prime FPGA, 80k Logic Cells |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DDR, DMA, PCIe |
| Supplier Device Package | 1369-FCBGA (35x35) |
| Architecture | MPU, FPGA |
| Flash Size | - |
Request a Quote
Clients Also Buy
XCVC1502-1MSENSVG1369
IC VERSAL AI-CORE FPGA 1369BGA
XCVE1752-1MSENSVG1369
IC VERSAL AI-CORE FPGA 1369BGA
XCVC1702-1MSENSVG1369
IC VERSAL AI-CORE FPGA 1369BGA
