XC7Z045-3FBG676E
IC SOC CORTEX-A9 1GHZ 676FCBGAManufacturer: AMD
Categories: System On Chip (SoC)
Quality Control: Learn More
The AMD Zynq®-7000 series XC7Z045-3FBG676E is a System On Chip (SoC) integrating a dual ARM® Cortex®-A9 MPCore™ processor with CoreSight™ and a Kintex™-7 FPGA fabric. This device features 350K logic cells and operates at a clock speed of 1GHz. The embedded processor subsystem includes 256KB of RAM and a DMA controller, supported by a comprehensive suite of peripherals including CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG connectivity. Designed for demanding applications, it is specified for an operating junction temperature range of 0°C to 100°C. The robust 676-FCBGA (27x27) package facilitates high-density interconnectivity. This component is commonly utilized in industrial automation, automotive, and embedded vision systems.
Additional Information
Series: Zynq®-7000RoHS Status: ROHS3 CompliantManufacturer Lead Time: 16 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 676-BBGA, FCBGA |
| Speed | 1GHz |
| RAM Size | 256KB |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Primary Attributes | Kintex™-7 FPGA, 350K Logic Cells |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DMA |
| Supplier Device Package | 676-FCBGA (27x27) |
| Architecture | MCU, FPGA |
| Flash Size | - |
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