Manufacturer: AMD
Categories: System On Chip (SoC)
Quality Control: Learn More
Packaging | Tray |
Package / Case | 900-BBGA, FCBGA |
Speed | 667MHz |
RAM Size | 256KB |
Operating Temperature | -40°C ~ 100°C (TJ) |
Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Primary Attributes | Kintex™-7 FPGA, 275K Logic Cells |
Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Peripherals | DMA |
Supplier Device Package | 900-FCBGA (31x31) |
Architecture | MCU, FPGA |
Flash Size | - |