XC7Z030-1FBG676I
IC SOC CORTEX-A9 667MHZ 676FCBGAManufacturer: AMD
Categories: System On Chip (SoC)
Quality Control: Learn More
The AMD Zynq®-7000 series XC7Z030-1FBG676I is a System On Chip (SoC) featuring a Dual ARM® Cortex®-A9 MPCore™ processor with CoreSight™. This device integrates a Kintex™-7 FPGA fabric with 125K logic cells, clocked at 667MHz. It offers extensive connectivity options including CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. On-chip peripherals include DMA, and 256KB of RAM. The XC7Z030-1FBG676I is housed in a 676-FCBGA (27x27) package and operates within an industrial temperature range of -40°C to 100°C (TJ). This component is suitable for applications in industrial automation, medical imaging, and aerospace and defense sectors.
Additional Information
Series: Zynq®-7000RoHS Status: ROHS3 CompliantManufacturer Lead Time: 16 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 676-BBGA, FCBGA |
| Speed | 667MHz |
| RAM Size | 256KB |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Primary Attributes | Kintex™-7 FPGA, 125K Logic Cells |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DMA |
| Supplier Device Package | 676-FCBGA (27x27) |
| Architecture | MCU, FPGA |
| Flash Size | - |
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