XAZU7EV-1FBVB900I
IC SOC CORTEX-A53 900FCBGAManufacturer: AMD
Categories: System On Chip (SoC)
Quality Control: Learn More
The AMD Zynq® UltraScale+™ MPSoC EV series device, part number XAZU7EV-1FBVB900I, is a heterogeneous System on Chip (SoC) integrating a powerful processing system with a flexible programmable logic fabric. It features a Quad ARM® Cortex®-A53 MPCore™ processor with CoreSight™, a Dual ARM® Cortex™-R5 processor with CoreSight™, and an ARM Mali™-400 MP2 graphics processing unit. The device includes Zynq® UltraScale+™ FPGA fabric offering 192K+ logic cells. Connectivity options include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. Peripherals such as DMA and WDT are also integrated. This component operates within a temperature range of -40°C to 100°C (TJ) and is housed in a 900-FCBGA (31x31) package. Its architecture supports MCU and FPGA functionalities, making it suitable for applications in industrial automation, automotive, aerospace, and defense. The processor speeds range from 500MHz, 600MHz, to 1.2GHz, with 256KB of RAM.
Additional Information
Series: Zynq® UltraScale+™ MPSoC EVRoHS Status: ROHS3 CompliantManufacturer Lead Time: 16 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 900-BBGA, FCBGA |
| Speed | 500MHz, 600MHz, 1.2GHz |
| RAM Size | 256KB |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DMA, WDT |
| Supplier Device Package | 900-FCBGA (31x31) |
| Architecture | MCU, FPGA |
| Flash Size | - |
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