XAZU3EG-L1SFVA625I
IC SOC CORTEX-A53 625FCBGAManufacturer: AMD
Categories: System On Chip (SoC)
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The AMD Zynq® UltraScale+™ MPSoC EG XAZU3EG-L1SFVA625I is a heterogeneous System on Chip (SoC) integrating a Quad ARM® Cortex®-A53 MPCore™ processor with CoreSight™, Dual ARM® Cortex™-R5 processor with CoreSight™, and an ARM Mali™-400 MP2 graphics processing unit. This device also features a Zynq® UltraScale+™ FPGA fabric offering over 154,000 logic cells. It operates at clock speeds up to 1.2GHz for the application processor and 500MHz for the real-time processor. Connectivity options include CANbus, I2C, SPI, UART/USART, and USB. The device includes peripherals such as DMA and WDT, and has 1.8MB of on-chip RAM. It is supplied in a 625-FCBGA (21x21) package and is rated for an operating junction temperature range of -40°C to 100°C. This component is suitable for applications in aerospace, defense, industrial automation, and automotive sectors.
Additional Information
Series: Zynq® UltraScale+™ MPSoC EGRoHS Status: ROHS3 CompliantManufacturer Lead Time: 16 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 625-BFBGA, FCBGA |
| Speed | 500MHz, 1.2GHz |
| RAM Size | 1.8MB |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells |
| Connectivity | CANbus, I2C, SPI, UART/USART, USB |
| Peripherals | DMA, WDT |
| Supplier Device Package | 625-FCBGA (21x21) |
| Architecture | MPU, FPGA |
| Flash Size | - |
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