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XAZU3EG-1SFVC784I

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XAZU3EG-1SFVC784I

IC SOC CORTEX-A53 784FCBGA

Manufacturer: AMD

Categories: System On Chip (SoC)

Quality Control: Learn More

AMD Zynq® UltraScale+™ MPSoC EG XAZU3EG-1SFVC784I is a System On Chip (SoC) featuring a heterogeneous processing system. It integrates a Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ for application processing, alongside Dual ARM® Cortex™-R5 with CoreSight™ for real-time control. A graphics acceleration is provided by the ARM Mali™-400 MP2. This device also incorporates a Zynq®UltraScale+™ FPGA with over 154K logic cells. The component operates at speeds up to 500MHz for the processor system and 1.2GHz for the FPGA fabric. Connectivity options include CANbus, I2C, SPI, UART/USART, and USB interfaces. Peripherals such as DMA and WDT are also included. The XAZU3EG-1SFVC784I is supplied in a 784-FCBGA (23x23) package, suitable for industrial applications operating within a temperature range of -40°C to 100°C (TJ). This device is commonly utilized in industrial automation, automotive, and communications infrastructure markets.

Additional Information

Series: Zynq® UltraScale+™ MPSoC EGRoHS Status: ROHS3 CompliantManufacturer Lead Time: 16 week(s)Product Status: ActivePackaging: TrayDatasheet:
Technical Details:
PackagingTray
Package / Case784-BFBGA, FCBGA
Speed500MHz, 1.2GHz
RAM Size1.8MB
Operating Temperature-40°C ~ 100°C (TJ)
Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP
Primary AttributesZynq®UltraScale+™ FPGA, 154K+ Logic Cells
ConnectivityCANbus, I2C, SPI, UART/USART, USB
PeripheralsDMA, WDT
Supplier Device Package784-FCBGA (23x23)
ArchitectureMPU, FPGA
Flash Size-

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