XAZU3EG-1SFVA625I
IC SOC CORTEX-A53 625FCBGAManufacturer: AMD
Categories: System On Chip (SoC)
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AMD Zynq® UltraScale+™ MPSoC EG XAZU3EG-1SFVA625I is a System on Chip (SoC) featuring a heterogeneous processing system. It integrates a Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ for high-performance applications, alongside Dual ARM® Cortex™-R5 with CoreSight™ for real-time control tasks. A Mali™-400 MP2 graphics processing unit is also included. This device incorporates Zynq®UltraScale+™ FPGA fabric with over 154,000 logic cells, configurable to 500MHz. The processing system operates at up to 1.2GHz. On-chip memory includes 1.8MB of RAM. Connectivity options consist of CANbus, I2C, SPI, UART/USART, and USB interfaces. Peripherals such as DMA and WDT are also available. The operating temperature range is -40°C to 100°C (TJ). This component is supplied in a 625-FCBGA (21x21) package. It is suitable for applications in aerospace, defense, industrial automation, and automotive sectors.
Additional Information
Series: Zynq® UltraScale+™ MPSoC EGRoHS Status: ROHS3 CompliantManufacturer Lead Time: 16 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 625-BFBGA, FCBGA |
| Speed | 500MHz, 1.2GHz |
| RAM Size | 1.8MB |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells |
| Connectivity | CANbus, I2C, SPI, UART/USART, USB |
| Peripherals | DMA, WDT |
| Supplier Device Package | 625-FCBGA (21x21) |
| Architecture | MPU, FPGA |
| Flash Size | - |
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