XAZU1EG-1SFVA625I
IC ZUP MPSOC A53 FPGA Q 625BGAManufacturer: AMD
Categories: System On Chip (SoC)
Quality Control: Learn More
AMD XAZU1EG-1SFVA625I Zynq® UltraScale+™ MPSoC EG System On Chip (SoC). This device integrates a Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM® Cortex™-R5 with CoreSight™, and an ARM Mali™-400 MP2 graphics processing unit. It features a Zynq® UltraScale+™ FPGA fabric with 82,000 logic cells, operating at clock speeds up to 1.2GHz. The 625-FCBGA (21x21) package facilitates extensive connectivity options including CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. Peripherals include DMA and WDT. This SoC is suitable for demanding applications in industrial automation, automotive, and aerospace and defense sectors, with an operating temperature range of -40°C to 100°C (TJ).
Additional Information
Series: Zynq® UltraScale+™ MPSoC EGRoHS Status: ROHS3 CompliantManufacturer Lead Time: 23 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 625-BFBGA, FCBGA |
| Speed | 500MHz, 600MHz, 1.2GHz |
| RAM Size | 256KB |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 82K Logic Cells |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DMA, WDT |
| Supplier Device Package | 625-FCBGA (21x21) |
| Architecture | MPU, FPGA |
| Flash Size | - |
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