XCMECH-FFG668
IC MECHANICAL SAMPLE 668FCBGAManufacturer: AMD
Categories: Specialized ICs
Quality Control: Learn More
AMD XCMECH-FFG668 is a mechanical sample of an electronic component, specifically a 668-FCBGA package measuring 27x27. This surface mount device is supplied in trays, adhering to the 668-BBGA, FCBGA package standard. This component functions as a critical mechanical reference for advanced packaging development, often utilized in the validation and integration phases of high-performance computing and advanced graphics solutions. Its precise physical dimensions and packaging format are essential for ensuring compatibility and proper handling within complex manufacturing and testing environments.
Additional Information
Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: TrayDownload Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 668-BBGA, FCBGA |
| Mounting Type | Surface Mount |
| Type | Mechanical Sample |
| Applications | - |
| Supplier Device Package | 668-FCBGA (27x27) |
| Programmable | Not Verified |
Request a Quote
Clients Also Buy
XCMECH-FF1513
IC MECHANICAL SAMPLE 1513FCBGA
EK-U1-VCU129-G
KIT DEV VCU129 VIRTEX US+ 56G
EK-U1-VCU118-G
FPGA VCU118-G EVALUATION KIT
