XCVU13P-3FHGC2104E
IC FPGA 416 I/O 2104FCBGAManufacturer: AMD
Categories: FPGAs (Field Programmable Gate Array)
Quality Control: Learn More
AMD XCVU13P-3FHGC2104E Virtex® UltraScale+™ FPGA. This high-performance device features 416 user I/O pins and a substantial 3.78 million logic elements, supported by 216,000 LABs/CLBs. It offers 514,867,200 total RAM bits for extensive on-chip memory. Designed for demanding applications, the XCVU13P-3FHGC2104E operates within a junction temperature range of 0°C to 100°C and utilizes a supply voltage between 0.873V and 0.927V. The component is housed in a 2104-FCBGA package, suitable for surface mount applications, and is supplied in trays. This FPGA is widely deployed in telecommunications, data center acceleration, and high-performance computing sectors.
Additional Information
Series: Virtex® UltraScale+™RoHS Status: ROHS3 CompliantManufacturer Lead Time: 20 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 2104-BBGA, FCBGA |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Voltage - Supply | 0.873V ~ 0.927V |
| Number of Logic Elements/Cells | 3780000 |
| Supplier Device Package | 2104-FCBGA (52.5x52.5) |
| Number of LABs/CLBs | 216000 |
| Total RAM Bits | 514867200 |
| Number of I/O | 416 |
| Programmable | Not Verified |
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