AMD XCV200 Field Programmable Gate Array (FPGA) in a 256-pin Ball Grid Array (BGA) package. This component offers 180 user I/O pins, providing robust connectivity for complex digital designs. Built for high-performance applications, the XCV200 is suited for demanding tasks in telecommunications, industrial automation, and consumer electronics. Its versatile architecture allows for custom logic implementation, making it a valuable asset in prototyping and production environments where flexibility and speed are paramount. The Tray packaging ensures efficient handling and integration into automated assembly processes.
Additional Information
Series:RoHS Status:Manufacturer Lead Time:Product Status: ActivePackaging: Tray