The AMD XCV1600E-6FG860C is a high-performance Field Programmable Gate Array (FPGA) designed for demanding applications. This ceramic 860-pin Flip-Chip Ball Grid Array (FCBGA) package offers 660 user I/O pins, enabling extensive connectivity and flexibility. Fabricated with advanced process technology, this device delivers exceptional logic density and speed, making it suitable for complex digital signal processing, high-speed communication, and data intensive computing tasks. Its robust architecture supports a wide range of design implementations, from custom logic acceleration to system-on-chip integration. This component is commonly utilized in telecommunications infrastructure, industrial automation, aerospace and defense systems, and advanced computing platforms. The XCV1600E-6FG860C is supplied in trays for efficient integration into high-volume manufacturing processes.
Additional Information
Series:RoHS Status:Manufacturer Lead Time:Product Status: ActivePackaging: Tray