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XCS30-3TQ144C

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XCS30-3TQ144C

IC FPGA 113 I/O 144TQFP

Manufacturer: AMD

Categories: FPGAs (Field Programmable Gate Array)

Quality Control: Learn More

AMD Spartan® XCS30-3TQ144C Field Programmable Gate Array (FPGA) featuring 113 I/O and 30,000 gates. This device offers 1368 logic elements and 576 logic array blocks (LABs) or configurable logic blocks (CLBs), with 18432 RAM bits for data buffering and storage. The XCS30-3TQ144C operates within a temperature range of 0°C to 85°C (TJ) and requires a supply voltage of 4.75V to 5.25V. It is housed in a 144-TQFP (20x20) surface-mount package, supplied in trays. This FPGA is suitable for applications in telecommunications, industrial control, and consumer electronics.

Additional Information

Series: Spartan®RoHS Status: RoHS non-compliantManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: TrayDatasheet:
Technical Details:
PackagingTray
Package / Case144-LQFP
Mounting TypeSurface Mount
Number of Gates30000
Operating Temperature0°C ~ 85°C (TJ)
Voltage - Supply4.75V ~ 5.25V
Number of Logic Elements/Cells1368
Supplier Device Package144-TQFP (20x20)
Number of LABs/CLBs576
Total RAM Bits18432
Number of I/O113
ProgrammableNot Verified

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AMD FAQs

AMD is a semiconductor company founded in 1969 that began with logic and memory chips before expanding into microprocessors in the 1980s, becoming a major competitor to Intel.

The company helped shape modern computing with key innovations like 64-bit x86 processors and early multi-core CPUs in the 2000s and strengthened its position in graphics by acquiring ATI Technologies in 2006.

After a period of decline, AMD returned to prominence with the launch of its Zen architecture and Ryzen processors in 2017, establishing itself as a leader in CPUs, GPUs, and high-performance computing today. In 2022, AMD further expanded into adaptive computing with its acquisition of Xilinx, adding FPGAs and adaptive SoCs to its portfolio.

Learn More: The History of AMD - A Complete Overview

AMD/Xilinx designs and develops high-performance computing and graphics semiconductor solutions, with a focus on CPUs, GPUs, and adaptive computing technologies.

AMD/Xilinx core components include:

  • CPUs (central processing units) for desktop, mobile, and server applications
  • GPUs (graphics processing units) for gaming, professional visualization, and data centers
  • Adaptive SoCs and FPGAs (Xilinx acquisition)
  • Data center accelerators for AI and high-performance computing (HPC)
  • Embedded processors for industrial and edge applications
  • Chipsets and supporting platform technologies

AMD specializes in high-performance, energy-efficient computing solutions for data-intensive and graphics-driven workloads.

AMD serves industries that require high-performance computing, graphics processing, and scalable data center solutions.

AMD’s key industries include:

  • Data centers and cloud computing
  • Artificial intelligence (AI) and machine learning
  • Gaming
  • Professional visualization and content creation
  • Embedded systems and industrial applications
  • Telecommunications and networking

These industries rely on AMD for compute performance, scalability, and advanced processing architectures.

AMD/Xilinx is known for high-performance CPUs, FPGAs, CPLDs, GPUs, and adaptive computing platforms.

Key AMD/Xilinx product lines include:

  • Ryzen - desktop and mobile processors for consumer and commercial systems
  • EPYC - server processors for data centers and enterprise workloads
  • Spartan - FPGAs for cost sensitive and low power applications
  • CoolRunner - CPLDs for low power and control applications
  • Artix - FPGAs for low power and cost optimized performance
  • Kintex - FPGAs for mid range performance and efficiency
  • Virtex - FPGAs for high performance and data intensive applications
  • Versal - adaptive SoCs for AI, edge, and embedded systems
  • Zynq - SoCs combining ARM processors with FPGA fabric for embedded applications
  • Threadripper - high-core-count processors for workstation and enthusiast markets
FPGA FAQs

A Field-Programmable Gate Array (FPGA) is a programmable semiconductor device that engineers can configure after manufacturing to perform custom hardware functions. Unlike CPUs or GPUs, FPGAs process data in parallel, making them ideal for high-speed computing, AI acceleration, telecommunications, aerospace, industrial automation, and embedded systems.

An FPGA works by using programmable logic blocks and configurable interconnects that engineers customize using hardware description languages (HDLs) such as VHDL or Verilog. This architecture allows the FPGA to process multiple operations simultaneously for real-time performance and low latency.

FPGAs are used in:

  • AI and machine learning acceleration
  • Telecommunications infrastructure
  • Industrial automation
  • Aerospace and defense systems
  • Automotive electronics
  • Video and image processing
  • Embedded computing applications

The difference between an FPGA and a CPU is architecture. CPUs execute instructions sequentially, while FPGAs process data in parallel using customizable hardware logic. This makes FPGAs faster for specialized workloads like AI inference, signal processing, and real-time computing.

CPLDs are optimized for simpler control logic and predictable timing, while FPGAs provide higher logic density and advanced parallel processing for complex applications.

ASICs are custom-built for a specific application, delivering maximum performance, power efficiency, and unit cost optimization at high volumes, while FPGAs offer reprogrammability, faster development cycles, and greater design flexibility for evolving or lower-volume applications.

Frequently Asked Questions

As a full line supplier, we specialize in sourcing obsolete and hard to find electronic components for your projects.

After we receive your request submission, one of our account executives will reach out to your team to gather more information about your project requirements and ensure we tailor the order to your needs.

Once requirements such as date codes, quantities, target prices, testing requirements, and more are discussed, our purchasing team will secure stock through Microchip USA’s direct access to manufacturing partners’ excess inventory lists.

Our operations teams will handle logistics and fulfillment to ensure supply chain continuity, and our support team will provide clear communication throughout the process.

Our net terms for electronic component sourcing are flexible and vary by order. Our account executives will work with you to ensure our terms meet your company’s needs. We also offer scheduled shipments and inventory management solutions to ensure a steady supply of electronic components, maintain cash flow, and maximize warranty periods. We always offer a warranty on all tested parts. See our sales terms and conditions for more information.

We partner with industry-leading AS6171 & AS6081-certified third party testing labs to mitigate risk and support a wide array of end uses for your company’s requirements. Testing includes but isn’t limited to: Decapsulation & Internal Dye Verification. X-Ray Inspection & Analysis, External Visual Inspection, Surface Texture Analysis (SEM), and Electrical Pin Correlation.