XCKU3P-L2FFVB676E
IC FPGA 280 I/O 676FCBGAManufacturer: AMD
Categories: FPGAs (Field Programmable Gate Array)
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AMD Kintex® UltraScale+™ FPGA, part number XCKU3P-L2FFVB676E, offers a robust solution for demanding applications. This device features 355,950 logic cells and 20,340 logic array blocks (LABs)/configurable logic blocks (CLBs), providing extensive design flexibility. With 31,641,600 total RAM bits and 280 user I/O pins, it supports complex data processing and high-bandwidth interfaces. The XCKU3P-L2FFVB676E operates within a junction temperature range of 0°C to 100°C and requires a supply voltage between 0.698V and 0.876V. Its 676-pin, 27x27mm FCBGA package is suitable for surface-mount assembly. This FPGA is commonly utilized in telecommunications, data center, and industrial automation sectors.
Additional Information
Series: Kintex® UltraScale+™RoHS Status: ROHS3 CompliantManufacturer Lead Time: 16 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 676-BBGA, FCBGA |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Voltage - Supply | 0.698V ~ 0.876V |
| Number of Logic Elements/Cells | 355950 |
| Supplier Device Package | 676-FCBGA (27x27) |
| Number of LABs/CLBs | 20340 |
| Total RAM Bits | 31641600 |
| Number of I/O | 280 |
| Programmable | Not Verified |
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